Material Processing

Laser Solutions for Material Processing

Laser material processing uses high power lasers to generate intense light beams in material fabrication. This can include welding, drilling, cutting, engraving or cleaning different materials as plastics, wood and metals.

  • Marking/Engraving
  • Metal welding
  • Plastic welding
  • Soldering/Brazing
  • Cladding
  • Cutting
  • Hardening/Softening
  • Laser cleaning
material-processing

Technical Parameters

Marking/Engraving

BPP: 0.3 – 5
Power: 10 – 100 W
Wavelength: NIR

Metal welding

BPP: 1 – 40
Power: 1 – 10 kW (thick sheets need more power)
Wavelength: NIR (blue for Cu [red-metals])

Plastic welding

BPP: 30 – 300 (sometimes ~ 10)
Power: 10 – 200 W
Technology shifts from 1 µm to 2 µm wavelength

Soldering/Brazing

BPP: 10 – 80 (soldering) 30 – 500 (brazing)
Power: 10 – 100 W (soldering) 300 W – 8 kW (brazing)
Wavelength: NIR

Cladding

BPP: 30 – 300
Power: 1 – 10 kW
Wavelength: NIR (blue for Cu [red-metals])

Cutting

BPP: 2 – 10
Power: 10 W – 10 kW (high power for metals)
Wavelength: NIR

Hardening/Softening

BPP: 50 – 1000
Power: 2 – 20 kW
Wavelength: NIR

Laser Cleaning

Rep.rate.: 10 – 20 kHz
Power: 100 – 1600 W
Wavelength: 1064 nm
Pulse width: < 100 ns

Related products

Discover our lasers for Material Processing Applications. We also provide laser solutions to customer specific needs. Fill out the form below for more information.

Diode Lasers

LQ-527-12

LU-LPQ-1064MJ

Multipath
532-3W

HIEN PULS
X5400-YAG

HIEN PULS
X5400-YLF

 

What are your application needs?

Please fill out the form bellow to request more information. We will answer you shortly.

Attach files | 2Mb max per file | Pdf - Doc - Jpg



* Required fields
I have read, understood and accept the Privacy Policy.