Encapsulated diode laser module with sealed housing and real macro-channels (0.9mmØ) that avoid the common issues with obstructions. The non-soldering technique used in the mounting of the laser bars, allows the use of electrodes with high thermal conductivity. As a result, high cooling efficiency and large operation and storage temperature range are achieved.
Various modes of laser operation are available up to continuous wave (CW) mode. The patented technology used in this high power laser package assures a diode laser free of “smile” effect with low pitch and minimum weight. The high power diode laser is offered in different wavelengths, with a possibility to combine. Micro optics are optional.
|Type||actively cooled||actively cooled|
|Wavelength tolerance [nm]||±20||±20|
|Output power per laser bar [W]||200||200|
|Operating current(4) [A]||up to 200||up to 200|
|Voltage @ connectors(5) [V]||-12||-12|
|Laser bars per stack||6||10|
|Pitch (bar to bar) [nm]||1.8||1.8|
|Output power [W]||600 up to 1200||1000 up to 2000|
|Coolant flow [l/min]||1.8||2.7|
|Duty cycle(10)||50% -CW||up to 50%|
|Coolant pressure [bar]||3.0||3.0|
|Coolant||90% destilled water + 10% ethyleneglycol||90% destilled water + 10% ethyleneglycol|
|Coolant conductivity [µS/cm]||5||5|
|Electrical connections||threads M3||threads M3|
|Water connections||water fittings for Ø3.5 mm tube||water fittings for Ø3.5 mm tube|
|Water temperature [°C](9)||~ 20||~ 20|
|Weigth(7) [g]||< 100||< 120|
|Package dimensions (HxWxL) [mm]||33 x 25.5 x 21.5||33 x 25.5 x 21.5|
|Expected life-time(8)||108 pulses||108 pulses|
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