HiEN PULS X5400-YLF

HiEN PULS X5400-YLF

High energy pulsed solid state laser solution for material processing, LIBS/RAMAN/IR Spectroscopy, OPO/DYE/Ti: Sa optical pumping, LiDAR & wind LiDAR

  • High pulse energies up to 1 J or more
  • Short warm up time of less than 2 min
HiEN PuLS X5400-YLF

Hien-puls-x5400

Technical specifications

Laser parameters
HiEN-15400 HiEN-25400 HiEN-35400
Fundamental wavelength 1053 nm
Linewidth < 100 pm
Repetition rate 1 – 500 Hz
Energy output at 1053 nm(1) < 200 mJ < 500 mJ < 1000 mJ
Energy output at 527 nm < 120 mJ < 300 mJ < 600 mJ
Energy output at 351 nm < 75 mJ < 175 mJ < 350 mJ
Pulse width 4 – 25 ns
Power stability < 1% @ 8 h < 1.5% @ 8 h < 2% @ 8 h
Pulse to pulse stability < 5% rms
Beam parameters
Divergence > 5 mrad > 6 mrad > 7 mrad
Beam quality M2 > 3 >5 > 7
Beam diameter 6 mm
Beam ellipticity > 95%
Pointing stability 50 µrad
Polarization ratio 100:1
Jitter < 1.5 ns
Operating parameters
Diode life-time(2) > 109
Coolant flow < 1.5 l/min < 4.5 l/min < 4.5 l/min
Coolant pressure < 3.5 bar
Coolant 90% Distilled water + 10% ethylene glycol
Warm up time < 2 min
Operating temperature 20 – 35 deg
Additional parameters
Weight (laser head) < 30 Kg
Weight (electronics) < 10 Kg
Laser head dimensions (L x W x H) 600 x 300 x 150 mm 600 x 450 x 150 mm 900 x 450 x 150 mm
Communications RS232 / USB
External trigger IN / OUT
Laser class product (EN-60825) 4

1. Per pulse
2. Reduced life time if use in conflict to the nominal operational condition

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Level of integration

Possible levels of integration for this product are marked in red

LI1
Level 1 direct diode fiber coupled lasers
DIRECT DIODE
LI2
Li2
DIRECT DIODE

MICRO-OPTICS

LI3
Li3
SUB-ASSEMBLIES

MICRO-OPTICS

HOUSING

PRISM

CRISTALS

LI4
Level-of-integration-4
LASER SYSTEMS

MICRO-OPTICS

HOUSING

PRISM

CRISTALS

ELECTRONIC COMPONENTS

FIBER OUTPUT

We provide our laser solutions with different level of integration, from direct beam to complex systems

Applications

Imaging

Imaging

Laser-based illumination sources for 3D Scanning, Radiography Imaging, CTP, Particle Image Velocimetry (PIV) and Pattern Projection
Material processing

Material Processing

High power lasers for use in material manufacturing as Welding, Drilling, Cutting, Cladding, Engraving or Cleaning
Light detecting and ranging (lidar)

Light Detecting and Ranging (LiDAR)

Laser technology based on single emitters, direct diode sources and high energy solid-state lasers for light detecting and raging applications
Security and target acquisition

Security and Target Acquisition

Diode lasers in low and high power for laser guidance, laser sight, target designation, ranging and defensive countermeasures

Your Custom Laser

We develop your laser solutions, to your needs. Fill in the form to define your desired parameters.

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